27-12-2006, 05:49 PM
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#9 (permalink)
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| 360 Fanboy Extraordinaire
Join Date: Jun 2006
Posts: 303 | I can't believe how horribly the thermal paste is applied to the cell and RSX chips...gooped so thick it's oozing out from the sides. Inefficient to the cooling process.....less is more, more is less. If it's metallic thermal paste that's even worse as it can cause short circuiting on the board itself.
Good Job Sony 
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